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3
ABOUT THE DEVELOPMENT BOARD
Through-hole prototyping (wrap-field) area, P3 and P4
..................................................................................
Through-hole prototyping (wrap-field) area, P3 and P4
The through-hole prototyping area has two parts, P3 and P4.
Through-hole
prototyping
(wrap-field)
area, P4
Through-hole signal rail, P3
Through-hole
signal rail, P3
Manufacturer part number: SAMTEC TSW-136-xx-D
where xx is the length of the header pins; you choose the connector that best fits
your application. P3 is a four-column, 144-signal, through-hole signal rail that
provides 1:1 access to all module signals. You can solder every 2.54mm through-hole
header. The size of the P3 connector is 4x36 pins (see the drawing following the
next paragraph) — note, however, that you can solder only a smaller header onto
the connector. If you want to solder a complete header over the through-hole signal
rail, use 2 headers of 2x36 pins each.
The signal assignments for P3 are the same as those for the edge connector, P3, on
the module; see "Pin assignment by SO-DIMM pin number," beginning on page 19, for
detail.
52
ConnectCore 9C/Wi -9C Hardware Reference, Rev D 05/2010
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